Thinner, Lighter iPhone Coming This Fall | Wall Street Journal

TAIPEI — Apple Inc. has placed orders for key components used in a next-generation iPhone it is preparing to launch sometime in the third quarter, according to people familiar with the situation.

According to some suppliers of components to Apple, the new version of the iPhone is expected to be thinner and lighter than the iPhone 4 and sport an 8-megapixel camera. One person said the new iPhone will operate on Qualcomm Inc.’s wireless baseband chips. The current iPhone 4 uses memory chips made by Samsung Electronics Co. and baseband chips from German chip maker Infineon Technologies AG, according to a report by market-research firm iSuppli Corp. Officials at both companies declined to comment.

Apple, like many other big personal-computer and consumer-electronics brands, doesn’t actually make most of its products. It hires manufacturing specialists—mainly companies from Taiwan that have extensive operations in China—to assemble its gadgets based on Apple’s designs. T

Read more: http://online.wsj.com/article/SB10001424052702303544604576429292482910586.html#ixzz1RKgklZw0

Read the entire article here:
Apple Preparing For New iPhone in Third Quarter – WSJ.com.

Advertisements

Leave a Reply

Please log in using one of these methods to post your comment:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s